PCB Modification

Need to be done within 1 week Basic Design Rules ================== Track Width 0.1mm BGA pad 0.2mm, pitchh 0.4mm Minimum Clearance (all) 0.1mm for Track-to-Track (TT), Track-to-Pad(TP), Pad-to-Pad(PP), Via-to-Track (VT), Via-to-Pad (VP) and Via-to-Via (VV) Use Plated-through-hole only, Via Hole/AR/Via Diameter 4/4/12(mils) 0.10/0.10/0.30mm Things to do ============ -First, create a pair of 3x1mm rectangular pad footprint, send it back to me, I will assign it to designator CO2, add net, and later you have to route it. -Change all via diameter to 0.3mm (quick job) -Change all BGA pad to at least 0.20mm (quick job), relocate to vias under pad (of BGA) and reroute where necessary-This is the main part of this project -Change 0.08mm track of the U1 fanout to 0.1mm track (by addding PTH and interlayer track you shall solve the problem)-This is the main part of this project -Change solder mask expansion to at least 0.1mm especially the vias (quick job) -Add Relief Connect (Thermal Relief) to the power and ground plane (quick job) -Fill the upper cutoff part of the board (quick job) -Fix Unrouted Net -Fix TT, TP, VV error -Add PCB Oultline Layer so that it is captured in the gerber -Check if test point are addd to UART, SPI, I2C -Move silk (the designator) to the center of component so when the assembly drawing is generated, all designator are properly indicated -Generate Gerber (after everything is confirm clear) Notes ===== Please feedback any violation according to your experience to make the board producible Please advice your cost and timeline Payment would be done once the pcb manufacturer feedback zero error